JIS Work Programme, Revised JIS, Electronics

PS-030-0150
JIS Work Programme
2020/07/02
No
Title
ICS No
Work
stage
International standard
Assigned Organization
Contact
C0806-1 Packaging of components for automatic handling-Part 1: Tape packaging of components with axial leads on continuous tapes 31.020.31.240 5 IEC 60286-1 Japan Electronics And Information Technology Industries Association b
C0806-3 Packaging of components for automatic handling-Part 3 : Packaging of surface mount components on continuous tapes 1 Japan Electronics And Information Technology Industries Association b
C0807 Product package labels for electronic components using bar code and two-dimensional symbologies 31.190; 31.200; 35.040.50 5 IEC 62090 Japan Electronics And Information Technology Industries Association b
C0950 The marking for presence of the specific chemical substances for electrical and electronic equipment 1 Japan Electronics And Information Technology Industries Association b
C5064 Fixed inductors for use in electronic and telecommunication equipment-Marking codes 29.100.10 5 IEC 61605 Japan Electronics And Information Technology Industries Association b
C5101-14-1 Fixed capacitors for use in electronic equipment-Part 14-1: Blank detail specification-Fixed capacitors for electromagnetic interference suppression andconnection to the supply mains-Assessment level DZ 31.060.10 5 IEC 60384-14-1 Japan Electronics And Information Technology Industries Association b
C5101-14-2 Fixed capacitors for use in electronic equipment-Part 14-2: Blank detail specification-Fixed capacitors for electromagnetic interference suppression and connection to the supply mains-Safety tests only 31.060.10 5 IEC 60384-14-2 Japan Electronics And Information Technology Industries Association b
C5101-21 Fixed capacitors for use in electronic equipment-Part21:Sectional specification:Fixed surface mount multilayer capacitors of ceramic dielectric,Class1 1 Japan Electronics And Information Technology Industries Association b
C5101-22 Fixed capacitors for use in electronic equipment-Part 22: Sectional specification-Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 1 Japan Electronics And Information Technology Industries Association b
C5101-26 Fixed capacitors for use in electronic equipment-Part 26: Sectional specification-Fixed aluminium electrolytic capacitors with conductive polymer solid electrolyte 1 Japan Electronics And Information Technology Industries Association b
C5445 Electromechanical switches for use in electrical and electronic equipment- Part 1: Generic specification 1 ※Japanese Standards Association b
C5925-5 Fiber optic WDM devices-Part 5: Non-connectorized single-mode fiber optic middle-scale 1xN DWDM devices 33.180.10 5 IEC 61753-081-2 Optoelectronics Industry And Technology Development Association b
C5982 F13 type connectors for optical fiber ribbons(MPO connectors) 33.180.20 5 Optoelectronics Industry And Technology Development Association b
C6121 Optical amplifiers - Generic specifications 2 ※Japanese Standards Association b
C6122-1-3 Optical amplifiers-Test methods-Part 1-3: Power and gain parameters-Optical power meter method 33.180.30 5 IEC 61290-1-3 Optoelectronics Industry And Technology Development Association b
C6122-10-1 Optical amplifiers-Test methods-Part 10-1: Multichannel parameters-Pulse method using an optical switch and optical spectrum analyzer 33.180.30 5 IEC 61290-10-1 Optoelectronics Industry And Technology Development Association b
C6186 Calibration of fiber-optic power meters 1 Optoelectronics Industry And Technology Development Association b
C6701 Generic specification of quartz crystal units 2 ※Japanese Standards Association b
C6703 Crystal filters 2 ※Japanese Standards Association b
C6710 Current name:Generic specification of crystal controlled oscillators 2 ※Japanese Standards Association b
C6790 Load test of a bolt-clamped Langevin vibrator using wattmeter method 1 Ultrasonic Manufacturersassociation Of Japan b
C6825 Test methods for structural parameters of optical fibers-Optical characteristics 33.180.10 3 IEC 60793-1-44,IEC 60793-1-43,IEC 60793-1-1,IEC 60793-1-45 Optoelectronics Industry And Technology Development Association b
C6836 All plastic multimode optical fiber cords 33.180.10 3 IEC 60794-2-41 Optoelectronics Industry And Technology Development Association b
C6838 Fiber ribbons 33.180.10;33.180.99 3 IEC 60794-1-31 Optoelectronics Industry And Technology Development Association b
C6840 Polarization crosstalk measurement of optical fiber 2 ※Japanese Standards Association b
C6870-2 Optical fiber cables-Part 2:Indoor cables-Sectional specification 2 ※Japanese Standards Association b
C6870-2-10 Optical fiber cables-Part 2-10:Indoor cables-Family specification for simplex and duplex cables 2 ※Japanese Standards Association b
C6870-2-20 Optical fiber cables-Part 2-20:Indoor cables-Family specification for multi-fiber indoor optical distribution cables 2 ※Japanese Standards Association b
C6873 Polarization-maintaining optical fiber 33.180.10 3 IEC 60793-2-70 Optoelectronics Industry And Technology Development Association b
C60068-2-58 Environmental testing-Part 2-58: Tests-Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) 19.040; 31.190 5 IEC 60068-2-58,IEC 60068-2-58 Amendment 1 Japan Electronics And Information Technology Industries Association b
C60068-2-69 Environmental testing-Part 2-69: Tests-Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method 1 Japan Electronics And Information Technology Industries Association b
C60068-2-82 Environmental testing - Part 2-82 : Tests - Test Tx: Whisker test methods for electronic and electric components 1 Japan Electronics And Information Technology Industries Association b
C61188-7 Printed boards and printed board assemblies-Design and use-Part 7: Electronic component zero orientation for CAD library construction 31.180 5 IEC 61188-7 Japan Electronics And Information Technology Industries Association b
C61191-1 Printed board assemblies-Part 1: Generic specification-Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies 1 Japan Electronics And Information Technology Industries Association b
C61191-2 Printed board assemblies-Part 2: Sectional specification-Requirements for surface mount soldered assemblies 31.190; 31.240 5 IEC 61191-2 Japan Electronics And Information Technology Industries Association b
C61191-3 Printed board assemblies-Part 3: Sectional specification-Requirements for through-hole mount soldered assemblies 31.240 5 IEC 61191-3 Japan Electronics And Information Technology Industries Association b
C61191-4 Printed board assemblies-Part 4: Sectional specification-Requirements for terminal soldered assemblies 31.240 5 IEC 61191-4 Japan Electronics And Information Technology Industries Association b
C61300-2-4 Fiber optic interconnecting devices and passive components-Basic test and measurement procedures-Part 2-4: Tests-Fiber or cable retention 33.180.20 2 IEC 61300-2-4,IEC 61300-2-4 Amendment 1 Optoelectronics Industry And Technology Development Association b
C61300-2-14 Fiber optic interconnecting devices and passive components-Basic test and measurement procedures-Part 2-14: Tests-High optical power 33.180.20 5 IEC 61300-2-14 Optoelectronics Industry And Technology Development Association b
C61300-2-17 Fiber optic interconnecting devices and passive components-Basic test and measurement procedures-Part 2-17: Tests-Cold 1 Optoelectronics Industry And Technology Development Association b
C61300-2-19 Fiber optic interconnecting devices and passive components-Basic test and measurement procedures-Part 2-19: Tests-Damp heat (steady state) 1 Optoelectronics Industry And Technology Development Association b
C61300-3-28 Fiber optic interconnecting devices and passive components-Basic test and measurement procedures-Part 3-28: Examinations and measurements - Transient loss 4 ※Japanese Standards Association b
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