JISC's International Activities in Recent Years

JISC fosters cooperative relationships with countries around the world through standardization initiatives that contribute to global economic growth.

[ Annual General Meeting (AGM) of the Pacific Area Standards Congress (PASC) ]

With the aim to strengthen collaboration and promote participation in international standardization activities, including ISO/IEC-related activities in the Asia-Pacific region, PASC was established as an independent and voluntary organization of Pacific Rim National Standards Bodies. PASC has 27 member countries/regions as of June 2025.

(Latest event)
The 47th PASC AGM was held in Tokyo from May 19 to May 21, 2025.

The initiatives of ISO/IEC/ITU-T were shared with the PASC members, who reaffirmed the importance of collaboration with ISO/IEC and cooperation among members, especially regarding digital transformation related to standards. Additionally, requests for support regarding elections and new proposals related to ISO and IEC were made.
From Japan, presentations were given on best practices related to Japan's standardization policy, the relationship between patents and standards, the electro-cyber-physical integration to meet net-zero goal and the future direction of international standards. Requests for cooperation were also announced regarding the JTC3 on quantum plenary meeting at Tokyo, the development of standards related to robots in collaboration with Singapore, perovskite, and the measurement of tyer abrasion tester, as well as certification schemes in the field of regenerative medicine.
As a result of the discussions at the AGM, new working groups were established, one of which is on digital transformation.

[ JISC-CEN/CENELEC Secretariat Meeting in Brussels ]

Since the late 1990s, JISC has been maintaining comprehensive cooperation relationship with the European Committee for Standardization (CEN) and European Committee for Electrotechnical Standardization (CENELEC), and concluded the Cooperation Agreement between JISC and CEN/CENELEC in 2014. Based on the Agreement, JISC and CEN/CENELEC periodically hold meetings between their secretariats.

(Latest event)
In 2024, JISC-CEN/CENELEC Secretariat Meeting was held on April 17 in Brussels, Belgium. Both sides exchanged updates of their respective standardization policies and outreach activities, and discussed issues on mutual interests.
The year 2024 marks the 10th anniversary of the Cooperation Agreement between CEN/CENELEC and JISC.
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[ The Northeast Asia Standards Cooperation (NEAS) Forum in Korea ]

The NEAS Forum is a standardization cooperation framework between China, Japan and the Republic of Korea (ROK). Since its inauguration in 2002, the NEAS Forum has been annually held and providing opportunities to stakeholders of international standardization in the three countries for enhancing standardization cooperation, promoting cooperation in some specific areas and smooth coordination between stakeholders.

(Latest event)
In 2024, the 22nd NEAS Forum was held from July 15 to 17, 2024 in Seoul, Korea. About 130 stakeholders in the field of standardization participated in the forum from national standardization bodies, standard associations, and other organizations in Japan, China, and the Republic of Korea (ROK). They exchanged information on policies and activities for standardization and delivered presentation on proposals for trilateral cooperation in developing international standards.

[ JISC/IEC-APCF(Asia-Pacific Cooperation Forum) Human Resource Development Seminar in Jakarta ]

The JISC/IEC-APCF Human Resource Development Seminar (formerly known as JISC/IEC-APSG Human Resource Development Seminar) has been organized by JISC in cooperation with the IEC Asia-Pacific Regional Centre since 2002. This seminar aims to cultivate experts and build networks to vitalize IEC international standardization activities in the Asia-Pacific region and the theme of the seminar is reviewed each year.

(Latest event)
The theme for 2024 was" Standardization of Semiconductors Supporting Future Asian industries and SDGs". Recent standardization activities in IEC TC 47 (Semiconductor devices) and SC 47D (Semiconductor devices packaging),as well as recent trends related to semiconductors in IEC, were introduced in the meeting held in December 2024 at KualaLumpur, Malaysia.